UV 355 laser marking machine free sample marking

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UV 355 laser marking machine free sample marking
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LASER TYPE

UV LASER

BEAM QUALITY

≥90%

LASER POWER

3/5/8/10 W

LASER WAVE LENGTH n

355 nm

AVERAGE POWER

>5w@40KHz

WORKING MATERIAL

ND:YVO4

BEAM MODE

TEM00(M2≤1.2)

MIN LINE WIDTH

0.01 mm

BEAM DIVERGENCE ANGLE

<2 mrad

MIN CHARACTER

0.2 mm

BEAM STEADY

≤3 %rms

REPEAT ACCURACY

±0.003 mm

PULSE FRENQUANCY

200 KHz

VOLTAGE

220v/ONE PHASE/50HZ/10A

Main Features

1.High electron-optic conversion rate, high light beam quality, extremely small light spot, capable for hyper-fine marking and engraving. Long non-linear crystal service life, stable machine running, high positioning accuracy, high working efficiency, modular design convenient for assembly and maintenance, stable machine performance, small volume, low power consumption.

2.Small heat-effected zone, no heating effect, no material deformation or scorching, almost perfect marking quality, precise marking result and capable for repeat machining. High precision and high-fine light spot guaranteeing perfect marking effect. Non-contact marking process. Permanent marking result.

3.Optional 2D automatic worktable. Multi-station successive marking or large-format marking. Capable to match up production line and realize automatic feed up and down, feed in and out.

4.Flexible and convenient operation system, humanized operation process, dedicated controlling software capable to realize automatic patching and modification of sign , graphic image, QR code, serial number, etc.; supporting PLT, PCX, DXF, BMP, JPT, directly using TTF word stock, CCD auto identification, tracking and positioning.

5.Super-fine marking line suitable for occasion with fine marking requirement, mainly used for fine marking of products like LCD, lens and IC, etc.
UV laser marking machine is the newly developed laser marking machine. The working principle is almost the same as other laser marking machine, making permanently mark on various material surface. Traditional marking machine adopts heat machining technology, the precision improvement is thus restricted. The UV laser marking machine adopts cold machining technology, the precision influenced by the heat is extremely reduced. This is anther leap of laser technology. Short wave laser interrupts material molecular chain directly( long wave laser vaporizes the surface materials, and exposes the deep layer material), and brings out the figures or words you want to engrave. The UV laser marking machine uses 355nm UV laser, the focusing spot is extremely small, greatly reducing the material mechanical deformation and machining heat affected zone. It is mainly suitable for hyper-fine marking and engraving and applied in fields like food and medical packing material marking, micro-punching, glass material high speed partition, and complicated figure cutting of silicon slice wafer.